ASML’s chip packaging move threatens Besi shares, Bank of America says

The Next Web
Read the full article
Bank of America downgraded BE Semiconductor Industries (Besi) to neutral and cut its price target nearly in half due to the threat of ASML entering the hybrid bonding market, which is crucial for Besi's growth. Besi faces competition and potential acquisition interest from US rivals, including Applied Materials, which owns 9% of Besi.

More in Industry & Manufacturing

Samsung aims to cut chip material development time using AI

Yonhap News Agency