Huawei Gets $2.3 Billion Offshore Loan as Chip Spending Soars

Bloomberg
Read the full article
Huawei has obtained a 15 billion yuan ($2.25 billion) loan from Chinese banks to support its increased investment in semiconductor technology for AI applications.

More in Chips & Compute

Chips & Compute3 min read

Jensen Huang’s Vision for Europe Runs on Plug-In Data Centers

Covered by 5 sources
Chips & Compute3 min read

DeepSeek Dials Up the Pressure on OpenAI and Anthropic With Open-Source Inference Tool

Covered by 7 sources
Chips & Compute4 min read

OpenAI to make its most advanced AI models available in Google Cloud

SiliconANGLE