Japan says progress made on $550B pact, with AI and chips weighing heavily on the next round

Japan's trade minister announced that AI and semiconductor projects will be a major focus in the next phase of its $550 billion investment pact with the US, following earlier rounds centered on energy and minerals. Meanwhile, the EU's framework lacks a direct investment fund but includes a $40 billion commitment to purchase US AI chips. Japan's approach involves a negotiated fund and project selection process, contrasting with the EU's purchase commitments and private investment forecasts.