Kandou AI raises $225 million to bet that copper can outlast the optical revolution

The Next Web
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Kandou AI secured $225 million in funding to advance its copper-based chip technology, aiming to compete with optical interconnects in data centers and computing. The company focuses on high-speed, energy-efficient data transmission using copper wiring. This investment supports Kandou's goal to provide a cost-effective alternative to optical solutions in the semiconductor industry.

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