LightSpeed Photonics plans packaging pilot line in India; eyes 50% local production by 2028: CEO Rohin Y

LightSpeed Photonics plans to open a photonics-packaging pilot line in India to shift at least 50% of its production there by 2028, aiming to shorten development time and build local capabilities. The pilot line will initially support internal R&D, with assembly and packaging moving from Singapore to India, while chip components will still be imported.