Nvidia reportedly wants all its HBM suppliers to use TSMC’s 3nm process

Nvidia has requested that all its custom high-bandwidth memory (NVHBM) suppliers, including Samsung, SK Hynix, and Micron, produce the base die using TSMC's 3nm process to ensure consistency and improve performance. This base die shift enables higher bandwidth and lower power consumption by moving the memory controller off the GPU. TSMC is expanding 3nm production capacity to meet growing HBM demand, while Samsung maintains its own process for standard HBM products.