Qualcomm says its first HBC chips for the Dragonfly AI250 pass lab tests

Qualcomm has successfully tested its first High Bandwidth Compute (HBC) memory chips for the Dragonfly AI250 accelerator, designed to enhance AI model performance in data centers by increasing memory bandwidth and energy efficiency. The AI250, featuring 133TB/s bandwidth, is expected to sample in early 2027 and will be part of Qualcomm's Dragonfly Rack server solution targeting cloud providers.