Chips & Compute2 min reading time

Samsung announces next-gen 3D memory when all we want is reasonably priced DDR5

Engadget
Read full post
Samsung revealed advanced 3D memory technologies including zHBM, V10 BV-NAND, zNAND-O, and LPDDR5X-PIM at the Future of Memory and Storage show, targeting AI data centers and edge AI environments. These innovations promise significant boosts in memory density, performance, and energy efficiency but are expected to primarily serve AI infrastructure rather than consumer PCs.

More in Chips & Compute

Chips & Compute4 min read

Jensen Huang explains why Nvidia will grow an astounding 70% next year

TechCrunch

Microsoft AI Focused Data Center Plan to Add 26 Gigawatts of Compute

Bloomberg

Tencent-Backed Chipmaker Enflame Jumps 188% in Shanghai Debut

Bloomberg