Chips & Compute4 min reading time

SK Hynix and SanDisk reveal first specs for High Bandwidth Flash — but don't get too excited, you probably won't be able to buy it anytime soon

TechRadar
Read full post
SK Hynix and SanDisk have released the first technical specification for High Bandwidth Flash (HBF), offering up to 512GB capacity and bandwidths from 0.4TB/s to 3.0TB/s. The technology uses the UCIe interconnect and aims for AI inference device samples by early 2027, though commercial availability may be in late 2027 or 2028.

More in Chips & Compute

Chips & Compute4 min read

Jensen Huang explains why Nvidia will grow an astounding 70% next year

TechCrunch

Microsoft AI Focused Data Center Plan to Add 26 Gigawatts of Compute

Bloomberg

Tencent-Backed Chipmaker Enflame Jumps 188% in Shanghai Debut

Bloomberg