Tower and NewPhotonics Ship Laser-Integrated PICs for AI Interconnect

Unite.AI
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Tower Semiconductor and NewPhotonics have started high-volume shipments of laser-integrated photonic integrated circuits (PICs) designed for AI interconnects, supporting data rates from 800G to 1.6T. These PICs are built on Tower's PH18DA silicon photonics platform and aim to meet growing demand for high-bandwidth, energy-efficient optical interconnects in AI infrastructure, with plans for 6.4T solutions in 2027.

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