TSMC breaks ground on more advanced packaging fabs in Chiayi

TSMC is expanding its advanced packaging facilities in the Chiayi Science Park, Taiwan, to meet growing demand for high-performance computing chips, especially for AI accelerators. The expansion includes three new fabs in Phase II, adding to two already operational in Phase I, aiming to boost annual output and create thousands of jobs. This development supports TSMC's CoWoS packaging process, critical for integrating logic and memory in AI chips, and forms part of a broader semiconductor and AI-